烘焙大豆的质构及品质变化规律

Changes in texture and quality of baked soybeans

中文关键词:  大豆  烘焙  美拉德反应  质构  品质

英文关键词:Soy, baking, maillard  reaction, texture, quality

中文摘要:

      目的 深入探讨烘焙大豆的质构及品质变化规律。方法 以华疆4号大豆为原料，利用电子感官、质构分析等技术手段，研究烘焙大豆5个不同温度及时间的25个处理组，分析烘焙对大豆籽粒感官及物性品质的影响，结合荧光光谱仪分析烘焙前后美拉德反应产物（Maillard reaction products, MRPS）差异，探讨热处理工艺对MRPS影响规律，明确大豆籽粒最佳烘焙工艺。结果 大豆硬度与烘焙温度及时间呈负相关，烘焙170℃ 30 min时硬度无显著差异（P>0.05）；电子感官数据发现大豆籽粒颜色随烘焙温度和时间的增加，超过170℃后L*、a*、b*和?E均无显著变化（P>0.05），基于以上数据明确大豆最佳烘焙工艺为170℃ 30 min。荧光光谱数据进一步验证在此工艺下，大豆籽粒产生了MRPS，提升烘焙大豆的风味品质。结论 大豆最佳烘焙工艺为170℃ 30 min，该研究结果为大豆高品质加工提供理论与技术支撑。

英文摘要:

      Objective To investigate the changes of texture and quality of baked soybean. Methods Using Huajing No. 4 soybean as raw material, electronic sensory analysis and texture analysis were used to study the effects of baking on the sensory and physical quality of soybean grain in 25 treatment groups of 5 different temperatures and time. The difference of Maillard reaction products (MRPS) before and after baking was analyzed by fluorescence spectrometer, and the effect of heat treatment on MRPS was explored to determine the best baking process for soybean seeds. Results Soybean hardness was negatively correlated with baking temperature and baking time. There was no significant difference in soybean hardness when baking at 170℃ for 30 min (P>0.05); The results of electronic sensory data showed that the L*, a*, b* and ?E of soybean grain increased with baking temperature and time, and there were no significant changes in L*, a*, b* and ?E above 170℃ (P>0.05). Based on the above data, the optimal baking process for soybean was 170℃ for 30 min. Fluorescence spectrum data further verified that MRPS were produced in soybean grains under this process, which improved the flavor quality of baked soybeans. Conclusion The optimal baking process of soybean is 170℃ for 30 min, which provides theoretical and technical support for high quality soybean processing.